Through Silicon Vias: Materials, Models, Design, and Performance

Through Silicon Vias: Materials, Models, Design, and Performance

作者 : Brajesh Kumar Kaushik / Vobulapuram Ramesh Kumar/ Manoj Kumar Majumder/ Arsalan Alam

出版社 : CRC Press

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定價 : NT 9,000

售價 : NT9,000


Fundamentals of Semiconductor Devicesprovides a realistic and practical treatment of modern semiconductor devices. A solid understanding of the physical processes responsible for the electronic properties of semiconductor materials and devices is emphasized. With this emphasis, the reader will appreciate the underlying physics behind the equations derived and their range of applicability. The author’s clear writing style, comprehensive coverage of the core material, and attention to current topics are key strengths of this book.Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
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Brajesh Kumar Kaushik
Brajesh Kumar Kaushik received the B.E. degree in Electronics and Communication Engineering from the D.C.R. University of Science and Technology (formerly C. R. State College of Engineering), Murthal, Haryana, in 1994, the M.Tech degree in Engineering Systems from Dayalbagh Educational Institute, Agra, India, in 1997, and the PhD degree under AICTE-QIP scheme from the Indian Institute of Technology Roorkee, Roorkee, India, in 2007. He is currently serving as Associate Professor in the Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee. His research interests include high-speed interconnects, low-power VLSI design, carbon nanotube-based designs, organic thin-film transistor design and modeling, and spintronics-based devices and circuits.

He has published extensively in several national and international journals and conferences of repute. Dr. Kaushik is a reviewer of many international journals belonging to various publication houses such as IEEE, IET, Elsevier, Springer, Emerald, Taylor and Francis etc. He has also delivered many keynote addresses in reputed international and national conferences. He also holds the position of the Editor and Editor-in-Chief of various journals in the field of VLSI and microelectronics. Dr. Kaushik is Editor-in-Chief of International Journal of VLSI Design and Communication System (VLSICS), AIRCC Publishing Corporation. He also holds the position of Editor of Microelectronics Journal (MEJ), Elsevier Inc.; Journal of Engineering, Design and Technology (JEDT), Emerald Group Publishing Limited; and Journal of Electrical and Electronics Engineering Research (JEEER), Academic Journals. He is a Senior Member of IEEE and has received many awards and recognitions from the International Biographical Center, Cambridge, U.K. His name has been listed in Marquis Who's Who in Science and Engineering and Marquis Who's Who in the World.
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